https://www.friendbookmark.com/authors/4165/pcb123 Most recent BlogU posts submitted by PCB123 https://www.friendbookmark.com/blogpost/26823/flip-chip-packaging-substrate-manufacturingFlip Chip Packaging Substrate Manufacturing. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 14 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a substrate with less than 10 layers. We have used the Msap technology to produce the track wi...